14 JANUARY 2011AL CIRCLE
Anomax Invents a Break-Thru High Thermal Dissipation Alumina Dielectric Electronic Substrate
Edited by : AL CIRCLE
1 min read
...Anomax Corporation Limited announced the invention of a breakthrough high heat dissipation substrate called Integrated Plated Circuit Heat Sink (IPCHS™). The new technology incorporates an aluminum base with a filled anodized dielectric layer and plated patterned circuits. This breakthrough enables extremely high thermal transfer, many times higher than currently available...
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