

Viettel Group, a state-owned multinational telecommunications and technology conglomerate, has launched construction of Vietnam's maiden semiconductor fabrication facility at Hoa Lac Hi-Tech Park in Hanoi. As part of the mission assigned by the Ministry of National Defence, this project represents a stepping stone in the semiconductor ecosystem.
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The plant will be built on a 27-hectare site within Hoa Lac Hi-Tech Park and is oriented to function as national infrastructure supporting research, design, testing, and semiconductor chip production. When it is operational, it will support both civilian and defence applications in important national industries like aircraft, telecommunications, IoT, automobile manufacturing, medical devices, and industrial automation.
While the country has increasingly gotten involved in five of the six major steps of semiconductor production: product definition, system design, detailed design, packaging and testing, and integration and testing, chip manufacturing remains the missing link. This semiconductor chip fabrication plant will enable Vietnam to carry out the complete chip production process domestically.
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During the groundbreaking ceremony, the Prime Minister of Vietnam, Pham Minh Chinh, emphasised the project’s strategic importance by stating,” The groundbreaking of Vietnam's first high-tech semiconductor chip fabrication plant is an event of particular significance. This is a step toward realising the national semiconductor industry development strategy, creating a foundation for Vietnam to gradually participate more deeply in the global value chain, based on science, technology, and innovation.”
He further noted that the plant would help complete the domestic semiconductor ecosystem, enabling chip design companies, technology start-ups, and research institutions to shorten testing cycles, accelerate product finalisation, and bring technologies into practical application more quickly.
Beyond manufacturing, the Hoa Lac plant is expected to play a central role in human capital development. It will function as a hands-on training centre linking education with real production environments. Under the Semiconductor Industry Human Resources Development Program, Vietnam aims to train 50,000 chip design engineers by 2030, with the workforce expected to exceed 100,000 professionals by 2040 under the National Semiconductor Strategy.
For Viettel, leading this project aligns with a long-standing focus on core technology development. The group has spent years preparing for this role through in-depth workforce training, international cooperation, technology transfer, and hands-on experience gained from chip research, design, and deployment in its technology systems and products.
Lieutenant General Tao Duc Thang, Chairman and CEO of Viettel Group, said,, Immediately after today's groundbreaking ceremony, the Group will begin implementing the project, with the set objective that by the end of 2027 we will complete the construction, receive technology transfer, and begin pilot production. The period from 2028 to 2030 will focus on finalising and optimising processes and improving line efficiency in accordance with industry standards, thereby serving as a basis for researching chip fabrication technology at more advanced process nodes."
The project will be completed over the course of 2026-2030, with a structured plan that includes construction, technology transfer, pilot production, and operational optimisation. In the long run, the Hoa Lac fab is intended to be scalable, laying the groundwork for Vietnam to eventually acquire more advanced semiconductor technologies.
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