The Japanese manufacturer of precious metals materials, TANAKA Holdings that focuses majorly on products for the electronics, semiconductor and automotive industries has publicized its subsidiary TANAKA Denshi Kogyo is planning to set up a new plant in the Chinese city of Hangzhou to boost the production capacity of aluminium bonding wires for power semiconductors. However, the plant is scheduled to begin operations in November 2022.
The establishment of this new plant forms part of TANAKA Denshi Kogyo's plans to augment its production capacity for aluminium bonding wires by approximately three-fold by 2025 to meet the growing global demand associated with the growth of power semiconductors.
Since 2001, TANAKA Denshi Kogyo has been manufacturing various bonding wires and providing technical services at its subsidiary, TANAKA Electronics (Hangzhou) Co., Ltd. in China.
Now, with the recent imbalance of global supply and demand for semiconductors resulting in a worsening shortage of semiconductors, it has been a matter of urgency to establish a stable supply system for high-quality bonding wires as an important peripheral material for the semiconductor industry. To meet the towering demand associated with the domestic production of power semiconductors in China, in particular, the new plant will be built to deliver a steady supply system for aluminium bonding wires.
TANAKA Denshi Kogyo pursues to contribute to the semiconductor industry by supplying to the countries around the globe even during states of emergency, as a leading producer of bonding wire.
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