LQDX, formerly known as Averatek Corp. and a developer of high-performance materials for advanced semiconductor manufacturing, has announced the successful divestiture of its Aluminum Clad Laminate IP (ACL™) intellectual property to Toyo Aluminium K.K.
Toyo Aluminium, a global leader in speciality aluminium products serving the consumer, electronics, and automotive industries, will acquire specific IP rights to support the scale-up and commercialisation of ACL™.
"We are thrilled to complete this transaction with Toyo Aluminium. Toyo Aluminium K.K has made a deep investment in the development of ACL™ technology, and their unique aluminium expertise enables continuing innovation and scale-up in the critical fields of advanced semiconductor packaging and fine-line IC-substrates," said Simon McElrea, LQDX CEO.
As part of the agreement, LQDX or its affiliates will continue to supply the critical Liquid Metal Ink component integral to the technology.
Aluminum Clad Laminate (ACL™) technology integrates a thin aluminium foil featuring a precisely engineered nano-textured surface with an ultra-thin layer of LQDX's Liquid Metal Ink (LMI®), a palladium-based catalyst. This combination enables the reliable seeding and formation of ultra-fine conductive lines in Ultra High-Density Interconnect (UHDI) printed circuit boards and advanced semiconductor package IC substrates.
"Toyo Aluminium is committed to co-creation with leading companies in the substrate industry, which is prototyping of innovative substrates that leverage our proprietary aluminium technology. Incorporating LQDX's ACL™ Intellectual Property into our company's portfolio aligns with the expansion of our manufacturing business for Japan, Asia, and the US," added Katsura Morioka, Executive Officer, Toyo Aluminium K.K.
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