NewsEnd UserKulicke & Soffa introduces comprehensive solution for fine aluminium wire bonding
15 MARCH 2016Kulicke & Soffa Industries Press Release

Kulicke & Soffa introduces comprehensive solution for fine aluminium wire bonding

Edited by : AL CIRCLE
2 min read
Kulicke & Soffa introduces comprehensive solution for fine aluminium wire bonding
Kulicke & Soffa Industries, Inc., a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, today announced the introduction of a comprehensive solution dedicated for Fine Aluminum (Wedge-to-Wedge) Wire Bonding – with the new launched VitaCap™ Series of Capillaries and IConnPS PLUS™ Ball Bonder.

VitaCap™ is made from K&S’ leading ITA™ ceramics material, engineered for high quality Aluminium wedge bond and tail bond formation on any wire direction. Its unique features fit well with IConnPS PLUS™ Ball Bonder’s special wedge-to-wedge feature. Together, they deliver an innovative wire bonding platform for applications that uses fine Aluminium wire diameters (0.6-2.0 mil), supporting the Automotive, RF, Medical, LED and consumer segments.

The key advantages of this comprehensive solution are:

• Flexibility of using the Ball Bonder for either Aluminium or Gold wire
• Improved productivity resulting in lower cost of ownership over traditional wedge bonder
• Applicable for low loop application
• Capable to bond at low or room temperature
• Eliminate the use of forming gas to reduce cost

Chan Pin Chong, Kulicke & Soffa's Vice President of the Wedge Bonders, Capillaries and Blades Business Lines, said, “Customers will benefit from the comprehensive solution of our bonder system together with the application of VitaCap™, achieving higher throughput and process stability, while also lowering the cost of ownership.”

Nelson Wong, Kulicke & Soffa's Vice President of the Ball Bonder Business Line, remarked, “Kulicke & Soffa continues to focus on research and development to bring solutions to customers with unparalleled performance. The VitaCap™ coupled with our K&S Ball bonder provides one of the most innovative solutions on extending Fine Aluminum wire application.”

The VitaCap™ will debut at the SEMICON China show at the Shanghai New International Expo Centre, Hall N5, Booth #5331, from March 15-17, 2016.

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