
Atrenne Integrated Solutions, an electrical component and system provider for aerospace, defense, communications, and other technology-driven industries has announced a variation of their Small Form Factor (SFF) 760 Series electronic packaging design.
This system will enable off-the-shelf Mini-ITX and PCIe commercial electronics CCA's to be installed in airborne applications that operate on high altitudes above 50,000 feet. As a standard, commercial aluminium electrolytic capacitors are designed for atmospheric pressure corresponding to 10,000 feet and below. They are not designed to operate under low pressure condition. Commercial aluminium electrolytic capacitors will operate smoothly within this system.
Atrenne developed a hermetically sealed rugged enclosure which maintained a standard atmospheric pressure throughout, creating an artificial lab operating environment. Atrenne used a gasket in order to create a seal which will buffer mechanical obstructions between the two machined aluminium surfaces of the artificial enclosure.
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"A technology integrator presented us with a design challenge and our engineers were able to step up and find an innovative solution," said Steve Orsini, Director of Program Management, Atrenne Integrated Solutions. "Atrenne has deep domain expertise in mechanical design, thermal management, I/O conditioning and lean manufacturing. We brought all of our capabilities to bear to solve this extremely difficult technical challenge."
The strong enclosure design helped the system to meet stringent application requirements by blocking sensitive internal electronics from the extreme low pressure and heat of the external environment.
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